Prevents common defects like tombstoning (where a component stands up during reflow) or solder bridging (shorts between pads).
: Recommends rounded corners for rectangle pads, which improves solder paste release and reduces solder beads during reflow.
Many legacy CAD libraries pre-date Revision C. They may still use IPC-7351A era "Tombstone Reduction" patterns that actually increase defect rates with modern lead-free solders.
The deep truth: Choosing Level C because you want a smaller PCB, without validating your assembly house’s solder mask alignment capability, is gambling with field failures.
